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| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | OutputType | Direction | FrequencyRange | Sensitivity | S/NRatio | Impedance | Voltage-Rated | VoltageRange | Current-Supply | PortLocation | Ratings | Termination | Size/Dimension | Height(Max) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
IM69D130V01XTSA1MICROPHONE MEMS DIGITAL PDM OMNI Infineon Technologies |
3,345 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR),Cut Tape (CT) | - | Active | MEMS (Silicon) | Digital, PDM | Omnidirectional | 20 Hz ~ 20 kHz | -36dB ±1dB @ 94dB SPL | 69dB | - | - | 1.62 V ~ 3.6 V | 1.3 mA | Bottom | - | Solder Pads | 0.157 L x 0.118 W (4.00mm x 3.00mm) | 0.051 (1.30mm) |
|
IM69D120V01XTSA1MICROPHONE MEMS DIGITAL PDM OMNI Infineon Technologies |
2,524 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR),Cut Tape (CT) | - | Active | MEMS (Silicon) | Digital, PDM | Omnidirectional | 20 Hz ~ 20 kHz | -26dB ±1dB | - | - | - | 1.62 V ~ 3.6 V | 1.3 mA | Bottom | - | Solder Pads | 0.157 L x 0.118 W (4.00mm x 3.00mm) | 0.051 (1.30mm) |
|
IM67D120AXTSA1INTEGRATED PRESSURE SENS PG-LLGA Infineon Technologies |
945 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR),Cut Tape (CT) | XENSIV™ | Active | MEMS (Silicon) | Digital, PDM | Omnidirectional | 20 Hz ~ 20 kHz | -26dB ±1dB @ 94dB SPL | 67dB | - | - | 1.62 V ~ 3.6 V | 1.3 mA | Bottom | - | Solder Pads | 0.157 L x 0.118 W (4.00mm x 3.00mm) | 0.051 (1.30mm) |
|
IM67D130AXTSA2IC MEMS DGTL XENSIV LLGA-5 Infineon Technologies |
723 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR),Cut Tape (CT) | Automotive, AEC-Q103, XENSIV™ | Active | MEMS (Silicon) | Digital, PDM | Noise Cancelling | 20 kHz ~ 20 kHz | -36dB ±1dB @ 94dB SPL | 67dB | - | - | 1.62 V ~ 3.6 V | 980 µA | Bottom | - | Solder Pads | 0.157 L x 0.118 W (4.00mm x 3.00mm) | 0.051 (1.30mm) |
|
IM73A135V01XTSA1MICROPHONES_DIFFERENTIAT PG-LLGA Infineon Technologies |
3,334 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR),Cut Tape (CT) | XENSIV™ | Active | MEMS (Silicon) | Digital, PDM | Noise Cancelling | 28 Hz ~ 1 kHz | -38dB | 73dB | - | 2.75 V | 1.52 V ~ 3 V | 170 µA | Top | - | Solder Pads | 0.157 L x 0.118 W (4.00mm x 3.00mm) | 0.039 (1.00mm) |
|
IM72D128V01XTSA1IP57 DUST AND WATER RESISTANT DI Infineon Technologies |
3,786 | - |
RFQ |
Tape & Reel (TR),Cut Tape (CT) | XENSIV™ | Active | MEMS (Silicon) | Digital, PDM | Noise Cancelling | - | -36dB ±1dB @ 94dB SPL | 72dB | - | - | 1.62 V ~ 3.6 V | 980 µA | Bottom | IP57 - Dust Protected, Waterproof | Solder Pads | 0.157 L x 0.118 W (4.00mm x 3.00mm) | 0.047 (1.20mm) | |
|
|
IM69D127V11XTMA1MICROPHONES_DIFFERENTIAT PG-TLGA Infineon Technologies |
3,250 | - |
RFQ |
Tape & Reel (TR),Cut Tape (CT) | - | Active | MEMS (Silicon) | - | Noise Cancelling | 20 Hz ~ 20 kHz | - | 69dB | - | - | - | - | Top | - | - | 0.142 L x 0.098 W (3.60mm x 2.50mm) | 0.039 (1.00mm) | |
|
|
IM67D130AXTSA1MIC MEMS DIGITAL PDM NC -36DB Infineon Technologies |
2,096 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR),Cut Tape (CT) | Automotive, AEC-Q103, XENSIV™ | Obsolete | MEMS (Silicon) | Digital, PDM | Noise Cancelling | - | -36dB | 67dB | - | - | 1.62 V ~ 3.6 V | 980 µA | Bottom | - | Solder Pads | - | - |
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