Integrado - Sistema en chip (SoC)

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Package/Case Packaging Series ProductStatus Architecture CoreProcessor FlashSize RAMSize Peripherals Connectivity Speed PrimaryAttributes OperatingTemperature
WDC6202GJL250X

WDC6202GJL250X

WIRELESS 27MM 6202 WITH XBUS

Texas Instruments
3,341 -

RFQ

- Bulk * Active - - - - - - - - -
DRA829JMTGBALFR

DRA829JMTGBALFR

DUAL ARM CORTEX-A72, QUAD CORTEX

Texas Instruments
2,957 -

RFQ

827-BFBGA, FCBGA Tape & Reel (TR),Cut Tape (CT) - Active DSP, MCU, MPU ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x - 1.5MB DMA, PWM, WDT I²C, I³C, MCAN, MMC/SD/SDIO, SPI, UART, USB 2GHz, 1GHz, 1.35GHz, 1GHz - -40°C ~ 105°C (TJ)
TDA4VM88TGBALFR

TDA4VM88TGBALFR

NEXT GENERATION SOC FAMILY FOR L

Texas Instruments
2,172 -

RFQ

827-BFBGA, FCBGA Tape & Reel (TR),Cut Tape (CT) Automotive, AEC-Q100 Active DSP, MCU, MPU ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x - 1.5MB DMA, PWM, WDT MCAN, MMC/SDSD/IOI²C, SPI, UART, USB 2GHz, 1GHz, 1.35GHz, 1GHz - -40°C ~ 105°C (TJ)
TDA4VM88TGBALFRQ1

TDA4VM88TGBALFRQ1

NEXT GENERATION SOC FAMILY FOR L

Texas Instruments
3,988 -

RFQ

827-BFBGA, FCBGA Tape & Reel (TR),Cut Tape (CT) Automotive, AEC-Q100 Active DSP, MCU, MPU ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x - 1.5MB DMA, PWM, WDT MCAN, MMC/SDSD/IOI²C, SPI, UART, USB 2GHz, 1GHz, 1.35GHz, 1GHz - -40°C ~ 125°C (TJ)
TDA3MVRBFABFRQ1

TDA3MVRBFABFRQ1

IC SOC PROCESSOR

Texas Instruments
3,263 -

RFQ

367-BFBGA, FCBGA Tape & Reel (TR) - Active DSP, MPU ARM® Cortex®-M4, C66x - 512kB DMA, PWM, WDT CAN, MMC/SD/SDIO, McASP, I²C, SPI, UART, USB 212.8MHz, 745MHz - -40°C ~ 125°C (TJ)
DRA829VMTGBALFR

DRA829VMTGBALFR

DUAL ARM CORTEX-A72, QUAD CORTEX

Texas Instruments
2,363 -

RFQ

827-BFBGA, FCBGA Tape & Reel (TR) Automotive, AEC-Q100 Active DSP, MCU, MPU ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x - 1.5MB DMA, PWM, WDT MCAN, MMC/SDSD/IOI²C, SPI, UART, USB 2GHz, 1GHz, 1.35GHz, 1GHz - -40°C ~ 105°C (TJ)
DRA829VMTGBALFRQ1

DRA829VMTGBALFRQ1

DUAL ARM CORTEX-A72, QUAD CORTEX

Texas Instruments
2,173 -

RFQ

DRA829VMTGBALFRQ1

Ficha técnica

827-BFBGA, FCBGA Tape & Reel (TR) - Active DSP, MCU, MPU ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x - 1.5MB DMA, PWM, WDT I²C, I³C, MCAN, MMC/SD/SDIO, SPI, UART, USB 2GHz, 1GHz, 1.35GHz, 1GHz - -40°C ~ 125°C (TJ)
DRA829JMTGBALFRQ1

DRA829JMTGBALFRQ1

DUAL ARM CORTEX-A72, QUAD CORTEX

Texas Instruments
3,844 -

RFQ

827-BFBGA, FCBGA Tape & Reel (TR) - Active DSP, MCU, MPU ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x - 1.5MB DMA, PWM, WDT I²C, I³C, MCAN, MMC/SD/SDIO, SPI, UART, USB 2GHz, 1GHz, 1.35GHz, 1GHz - -40°C ~ 105°C (TJ)
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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